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■:: SUNFRAME SYSTEM BONDING & GROUNDING 19� BLUE RAVEN <br />■■ ; S FM MICRORAIL°' INSTALLATION GUIDE ; PAGE' ° UT <br />starY4lerb <br />sh5ie Ibe Only <br />TeuleuLTwguE, <br />IretaR rertlurMrartl <br />taree rouoweq: <br />6Jails: <br />senile <br />3;2S Ift <br />Io-14w:201 <br />.w <br />LUG DETAIL& TORQUE I NFO <br />LUG DETAIL& TORQUE I NFO <br />LUG DETAIL&TORQUE INFO <br />INm Lay -In Lug(GBL-4DM <br />I lam Flange Lug(%B-4) <br />Wiley WEEBWg(6.7) <br />• 10-32 mounting hardware <br />VV mounting hardware <br />V4•mounting hardware <br />• Torque m 5 fit -Lb <br />Torque m 75 in -lb <br />Torque m 10 fit -Lb <br />• AWG4-14-Solid or5tranded <br />AWG4-14-Solid or5tranded <br />AWG 6-14-Solid or5tranded <br />OTE: ISOLATE WPF <br />'LMIN4--_ _. _rr'COW' <br />System bonding is amomplished through modules.System grounding accomplished byatiacx hing <br />a ground leg to arty module at location on the modulespecified by the module manufacturer. <br />E-W BONDING PATH: <br />E-W module to module bonding is accomplished <br />with 2 pre -installed bonding pins which engage <br />on the secure side of the MicrorailTM and spike <br />- I <br />III tai - • <br />seyle ue OPLY <br />N-S BONDING PATH: <br />N-S module to module bonding is <br />acmmpUshed with bonding clamp with 2 integral <br />TmMriaLTaRgE; TERMHUTORQtR bonding pins. (refer also to alternate method) <br />IretaR rertlurMrartl MMLcarWstarartl <br />&14A oth 1ki- ft : tareue ; reeeMrq: <br />4144wF:3SRlbE 614RNF:lR-Ib - <br />- <br />Alienate niched <br />TRIMRAIL BONDING PATH: <br />Trimrail to module bonding is accomplished with <br />bonding clamp with integral bonding pin and <br />bonding T-bott (refer also to alternate method) <br />CERTIFIEL <br />W INSTN TION <br />PROFS IOp <br />ama.n <br />COMB Ok <br />an FIELD On <br />ses<eaexm <br />SPECSHEET <br />